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  • 11/30252855 DC : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING

    Available format(s):  Hardcopy, PDF

    Superseded date:  30-09-2016

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Definitions
    4 Introduction
    5 Soldering processability of components
    6 Soldering tests - general
    7 Soldering tests - Methods
    8 Requirements and the statistical character
      of results
    9 Abbreviations

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/501
    Document Type Draft
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC TR 60068-3-12:2014 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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