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  • CEI EN 60068-2-83 : 2012

    Current The latest, up-to-date edition.

    ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2012

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1. Scope
    2. Normative references
    3. Terms and definitions
    4. Test
    5. Preconditioning
    6. Preparation
    7. Quick heating method
    8. Synchronous method
    9. Temperature profile method
    Annex A (normative) - Equipment for the quick
                          heating and synchronous method
    Annex B (informative) - Reading of the output
                            data and correction of the result
                            in the quick heating test
    Annex C (normative) - Test equipment for the
                          temperature profile method
    Annex D (informative) - Reading of the output
                            data and correction of the result
                            in the temperature profile test
    Annex E (informative) - Caveats/Notes
    Bibliography
    Annex ZA (normative) - Normative references
                           to international publications
                           with their corresponding
                           European publications

    Abstract - (Show below) - (Hide below)

    Describes the methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 104-46. (11/2012)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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