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EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
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IEC 60068-1 : 7.0
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
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IEC 60068-2-20 : 5.0
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
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IEC 61190-1-2 : 3.0
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
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IEC 61249-2-7 : 1.0
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
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ISO 9455-2 : 1993(R2014)
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SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
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IEC 61189-1 : 1.1
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
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IEC 61189-6 : 1.0
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
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IEC 62137 : 1.0
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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN |
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IEC 61189-5 : 1.0
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
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ISO 9455-1 : 1990(R2016)
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SOFT SOLDERING FLUXES - TEST METHODS - PART 1: DETERMINATION OF NON-VOLATILE MATTER, GRAVIMETRIC METHOD |
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IEC 61190-1-1 : 1.0
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
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IEC 61189-3 : 2.0
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
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EN 61189-6 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
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ISO 5725-2 : 1994(R 2013)
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ACCURACY (TRUENESS AND PRECISION) OF MEASUREMENT METHODS AND RESULTS - PART 2: BASIC METHOD FOR THE DETERMINATION OF REPEATABILITY AND REPRODUCIBILITY OF A STANDARD MEASUREMENT METHOD |
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ISO 9001:2015
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QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
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IPC 9201 : A
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SURFACE INSULATION RESISTANCE HANDBOOK |
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EN 61190-1-3 : 2007 AMD 1 2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
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EN 61190-1-2 : 2014
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY (IEC 61190-1-2:2014) |
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IPC TR 467 : 0
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SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
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IEC 61189-2 : 2.0
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
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IEC 61190-1-3 : 2.1
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |