IEC 61760-4 : 1ED 2015

Current

Current The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES

Publisher: International Electrotechnical Committee

Published: 26-05-2015

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General information
5 Assessment of moisture sensitivity
6 Test procedure
7 Requirements to packaging and labelling
8 Handling of moisture sensitive devices
9 Drying
Annex A (informative) - Moisture sensitivity of assemblies
Annex B (informative) - Mass/gain loss analysis
Annex C (informative) - Baking of devices
Annex D (normative) - Moisture sensitivity labels
Bibliography

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Defines the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

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Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
ONORM OVE EN 61760-4 : 2016	Identical
BS EN 61760-4 : 2015	Identical
NEN EN IEC 61760-4 : 2015	Identical
NBN EN 61760-4 : 2015	Identical
PN EN 61760-4 : 2015	Identical
CEI EN 61760-4 : 2016	Identical
DS EN 61760-4 : 2015	Identical
NF EN 61760-4 : 2015	Identical
DIN EN 61760-4 : 2016	Identical
UNE-EN 61760-4:2015	Identical
DIN EN 61760-4 : 2016	Identical
NBN EN 61760-4 : 2015	Identical
EN 61760-4 : 2015 AMD 1 2018	Identical
ONORM OVE EN 61760-4 : 2016	Identical
NEN EN IEC 61760-4 : 2015	Identical
UNE-EN 61760-4:2015	Identical
PN EN 61760-4 : 2015	Identical
DS EN 61760-4 : 2015	Identical
CEI EN 61760-4 : 2016	Identical
BS EN 61760-4 : 2015	Identical
NF EN 61760-4 : 2015	Identical
JIS C 61760-4:2016	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN 62435-2:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
BS EN 60068-2-58 : 2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS EN 62435-2 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
BS EN 60068-3-13 : 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
11/30243259 DC : 0	BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS EN 62090 : 2017	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
16/30333617 DC : 0	BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
IEC 62090 : 2.0	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
I.S. EN 62090:2017	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
I.S. EN 60068-3-13:2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 60068-2-58 : 4.1	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 60068-2-58:2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 62435-2 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC 60068-3-13 : 1ED 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60749-20 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 60068-1 : 7.0	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
IEC 60068-2-58 : 4.1	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 61340-5-1 : 2.0	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC 60068-2-78 : 2.0B+(REDLINE+VERSION)	ENVIRONMENTAL TESTING - PART 2-78: TESTS - TEST CAB: DAMP HEAT, STEADY STATE
MIL PRF 131 : K	BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE
J STD 033 : C-1	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 61760-2 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
MIL PRF 27401 : G	PROPELLANT PRESSURIZING AGENT, NITROGEN
ISO 62 : 2008(R2016)	PLASTICS - DETERMINATION OF WATER ABSORPTION
ASTM D 570 : 1998 : R2018	Standard Test Method for Water Absorption of Plastics
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 60749-20-1 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

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IEC 61760-4 : 1ED 2015

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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