1 Scope and object
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
test severities
5 Test equipment
6 Test Td1: Solderability of terminations
7 Test Td2: Resistance to soldering heat
8 Test Td3: Dewetting and resistance to dissolution
of metallization
9 Final measurements
10 Information to be given in the relevant specification
Bibliography
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods
to through hole reflow soldering components (THR)
Annex D (informative) - Group 3: T4 related to size and
sensitivity for non-solid component