• BS EN 62435-2:2017

    Current The latest, up-to-date edition.

    Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  06-07-2017

    Publisher:  British Standards Institution

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    IEC62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with IEC 62435-1:2017 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.

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    Committee EPL/47
    Development Note Supersedes 13/30286163 DC. (Aman 07/2017)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
    J STD 033 : C-1 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IEC 60410:1973 Sampling plans and procedures for inspection by attributes
    IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage
    EN 190000 : 1995 GENERIC SPECIFICATION: MONOLITHIC INTEGRATED CIRCUITS
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