BS EN ISO 3543:2001
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Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
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IEC 60249-2-11:1987
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Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
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BS 123700:2001
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System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
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BS 123000:2001
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System of quality assessment. Generic specification. Printed boards
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BS EN 60249-2-12:1994
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Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
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BS EN 60249-2-13:1994
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Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade
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IEC 60249-2-8:1987
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Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
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BS 2011-2.1Ca:1977
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Environmental testing. Tests Test Ca. Damp heat, steady state
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BS 123200:2001
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System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
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IEC 60068-2-3:1969
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Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
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BS 6221-2:1991
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Printed wiring boards Methods of test
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BS 4584-103.1:1990
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Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
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IEC 60068-2-54:2006
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Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
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BS EN 60249-2-15:1994
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Specifications Flexible copper-clad polyimide film, of defined flammability
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BS EN 60249-2-8:1995
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Specifications Specification for flexible copper-clad polyester (PETP) film
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BS EN 123000:1992
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Harmonized system of quality assessment for electronic components. Generic specification: printed boards
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IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions
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IEC 60249-2-15:1987
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Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
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BS EN ISO 1463:2004
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Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
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BS 4727-1:GRP11(1991) : 1991
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GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
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IEC 60249-2-13:1987
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Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
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BS 123500-003:2001
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System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
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BS EN 60249-2-11:1994
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Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
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IEC 60249-2-12:1987
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Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
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