BS EN 123000:1992
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Hardcopy , PDF
22-10-2021
English
29-09-1989
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1. General
1.1 Scope
1.2 Object
1.3 Related documents
1.4 General consideration
1.5 Specification structure
2. Particular stipulations
2.1 Primary stage of manufacture
2.2 Structurally similar printed boards
2.3 Certified test records
2.4 Delayed delivery
2.5 Release for delivery before the completion of
Group B tests
2.6 Resubmission of rejected lots
2.7 Marking of printed board and package
2.8 Ordering information
3. Capability approval and maintenance of capability
approval
3.1 General
3.2 Capability approval requirements
3.3 Description of capability
3.4 QPL-information
3.5 Demonstration of capability
3.6 Capability approval test report
3.7 Range of capability approval
3.8 Maintenance of capability approval
3.9 Suspension and withdrawal of capability approval
3.10 Capability approval testing, sample size and
number of failures
3.11 Inspection information in the Cap DS
4. Quality conformance inspection
4.1 Inspection lot
4.2 Small lots and/or expensive printed boards
4.3 Grouping of tests
4.4 Inspection information in the CDS
4.5 In-process testing
4.6 Indirect measuring methods
5. Rules for the preparation of Detail Specifications
5.1 Capability Detail Specification (Cap DS)
5.2 Customer Detail Specification (CDS)
Appendix A - Example of a CDS
Appendix B - Specification structure
Appendix C - Example of QPL entries
Appendix D - Survey of abbreviations
Appendix E - Guide to the preparation of a Capability Manual for
printed boards
Defines system and procedure for approval of manufacturers and products and provides rules for the preparation of specifications.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23000(1989). 1992 Version incorporates amendment 7145 to BS CECC23000(1989). Supersedes 86/31647 DC, 94/216046 DC and 94/206559 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| EN 123000:1991/A2:1996 | Identical |
| NEN EN 123000 : 1995 AMD 2 1996 | Identical |
| CECC 23000 : 1985 | Identical |
| SN EN 123000 : AMD 2 1996 | Identical |
| I.S. EN 123000:1994 | Identical |
| DIN EN 123000 : 92 AMD 2 97 | Identical |
| BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS 123800:2001 | System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
| BS 123100:2001 | System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS CECC 23100-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
| BS EN 123800:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
| BS CECC 23200-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes |
| BS 9450:1998 | Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test |
| BS CECC 23300-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| BS CECC 123400-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| BS CECC 23600-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections |
| BS 123400:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123600:2001 | System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
| BS 123500:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections |
| BS 123700:2001 | System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123200:2001 | System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
| BS EN 123600:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS CECC 123500-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| BS 123300:2001 | System of quality assessment. Sectional specification. Rigid multilayer printed boards |
| BS 6312-2.2:1997 | Connectors for analogue telecommunication interfaces Sockets for use with plugs specified in BS 6312-1 - Particular requirements for fixed socket-outlets used in permanent wiring installations |
| BS EN 123700:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections |
| BS 9000-2(1996) : 1996 | GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM |
| BS 6001-1(1999) : 1999 | SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| CECC 00200 : 2002 | REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
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