BS EN 123400:1992
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Hardcopy , PDF
English
31-12-1990
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Foreword
Preface
Section 1 - Introduction
1.1 Scope and object
1.2 Related documents
Section 2 - General
Section 3 - Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
Section 4 - Relevant specification
Section 5 - Characteristics of printed boards
Section 6 - Capability test programme
Section 7 - Quality conformance inspection
Section 8 - Test patterns - test boards
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the composite test
patterns
Characteristics to be assessed and test methods used for capability approval testing and quality conformance inspection of boards without through connections.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23400(1990). 1992 Version incorporates amendment 7367 to BS CECC23400(1990). Supersedes 89/23561 DC and 94/216046 DC. To be read in conjunction with BS CECC23000(1989). (08/2005)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN 123400 : 1995 AMD 2 1995 | Identical |
| I.S. EN 123400:1994 | Identical |
| CECC 23400 : 1985 | Identical |
| DIN EN 123400:1992-11 | Identical |
| EN 123400:1992/A2:1995 | Identical |
| SN EN 123400 : AMD 2 1995 | Identical |
| BS CECC 123400-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| BS 9000-2(1996) : 1996 | GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM |
| CECC 23500 : 1985 | SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS |
| BS CECC23000(1989) : 1989 AMD 7145 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| CECC 00111 : 80 AMD 3 | CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011(1967) : LATEST | |
| BS 6221-7:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections |
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