BS EN 60749-20:2009
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Hardcopy , PDF
14-10-2020
English
31-01-2010
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1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (informative) - Details and descriptions of test
method on resistance of plastic encapsulated SMDs
to the combined effect of moisture and soldering
heat
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS EN 60749. (09/2005) Supersedes 07/30168484 DC. (01/2010)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.
| Standards | Relationship |
| IEC 60749-20:2008 | Identical |
| UNE-EN 60749-20:2004 | Identical |
| DIN EN 60749-20:2010-04 | Identical |
| NBN EN 60749-20 : 2010 | Identical |
| EN 60749-20:2009 | Identical |
| NF EN 60749-20 : 2010 | Identical |
| I.S. EN 60749-20:2009 | Identical |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60749-35:2006 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components |
| IEC 60749-35:2006 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| EN 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
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