BS EN 61076-4-113:2003
Current
Current
The latest, up-to-date edition.
Connectors for electronic equipment Printed board connectors with assessed quality Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
28-03-2003
Publisher
Committee |
EPL/48
|
DevelopmentNote |
Supersedes 98/232604 DC (04/2003)
|
DocumentType |
Standard
|
Pages |
42
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
IEC 61076-4-113:2002 Specifies for two-part connectors having 5 rows (160 contacts) with a grid of 2,54 mm for printed boards and backplanes in bus applications.
Standards | Relationship |
IEC 61076-4-113:2002 | Identical |
SN EN 61076-4-113 : 2003 | Identical |
I.S. EN 61076-4-113:2003 | Identical |
EN 61076-4-113:2003 | Identical |
DIN EN 61076-4-113:2003-08 | Identical |
IEC GUIDE 109:2012 | Environmental aspects - Inclusion in electrotechnical product standards |
IEC 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
EN 60097:1993 | Grid systems for printed circuits |
EN 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
EN ISO 1302:2002 | Geometrical Product Specifications (GPS) - Indication of surface texture in technical product documentation (ISO 1302:2002) |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
HD 625.1 : 200S1 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PRINCIPLES, REQUIREMENTS AND TESTS |
EN 61076-4:1996 | Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
IEC 60097:1991 | Grid systems for printed circuits |
EN 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
IEC 60603-2:1995 | Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features |
EN 60352-5:2012/AC:2014 | SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
ISO 1302:2002 | Geometrical Product Specifications (GPS) Indication of surface texture in technical product documentation |
IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 60603-2:1998/A1:2005 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 MM (0,1 IN) WITH COMMON MOUNTING FEATURES |
IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
IEC 61076-4:1995 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
IEC 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
EN 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
HD 323.2.54 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD |
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