BS EN 61193-1:2002
Current
The latest, up-to-date edition.
Quality assessment systems Registration and analysis of defects on printed board assemblies
Hardcopy , PDF
English
14-05-2002
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INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Defect registration
4.1 Accept criteria
4.2 Counting of defects
4.3 Post-soldering defect registration
4.3.1 Defects found after testing
4.4 Defect subdivision
4.4.1 Defect sources
4.4.2 Defect registration form
4.5 Rework immediately prior to soldering
4.6 Defect data categories
5 Processing the data
6 Analysis
Annex A (normative) Subprocesses
Annex B (informative) Examples of product defect qualification
Annex C (informative) Examples of calculations
Annex D (informative) Example of registration of defects and
processing of the data
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Specifies methods of registration and analysis of defects on soldered printed board assemblies.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 61193-1 Supersedes 96/204229 DC (05/2002)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
| Standards | Relationship |
| DIN EN 61193-1:2002-07 | Identical |
| EN 61193-1:2002 | Identical |
| NF EN 61193-1 : 2002 | Identical |
| NBN EN 61193-1 : 2002 | Identical |
| I.S. EN 61193-1:2002 | Identical |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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