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  • IEC 60068-2-66:1994

    Current The latest, up-to-date edition.

    Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  22-06-1994

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    Committees responsible
    National foreword
    Foreword
    1. Scope
    2. General description
    3. Description of test apparatus
    4. Severities
    5. Initial measurements
    6. Testing
    7. Intermediate measurements
    8. Recovery
    9. Final measurements
    10. Information to be given in the relevant specification
    Annexes
    A. Steam table
    B. Physical significance of the test
    C. Determination of humidity
    D. Test apparatus and handling

    Abstract - (Show below) - (Hide below)

    IEC 60068-2-66:1994 Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects, such as corrosion and deformation.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as BS EN 60068-2.66. (09/2005) Stability Date: 2019. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60674-3-8 : 2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011)
    17/30352083 DC : DRAFT JUL 2017 BS EN 62244 - RADIATION PROTECTION INSTRUMENTATION - INSTALLED RADIATION PORTAL MONITORS (RPMS) FOR THE DETECTION OF ILLICIT TRAFFICKING OF RADIOACTIVE AND NUCLEAR MATERIALS
    15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    IEC 60674-3-8:2011+AMD1:2016 CSV Plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Balanced biaxially oriented polyethylene naphthalate (PEN) films used for electrical insulation
    EN 61010-2-012:2016 Safety requirements for electrical equipment for measurement, control and laboratory use - Part 2-012: Particular requirements for climatic and environmental testing and other temperature conditioning equipment
    EN 60068-3-4:2002 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
    EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    16/30309512 DC : 0 BS EN 62327 ED 2.0 - RADIATION PROTECTION INSTRUMENTATION - HAND-HELD INSTRUMENTS FOR THE DETECTION AND IDENTIFICATION OF RADIONUCLIDES AND FOR THE ESTIMATION OF AMBIENT DOSE EQUIVALENT RATE FROM PHOTON RADIATION
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    BS EN 60068-3-4:2002 Environmental testing Supporting documentation and guidance - Damp heat tests
    BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    CEI EN 60068-3-4 : 2002 ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE DAMP HEAT TESTS
    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    CEI EN 60674-3-8 : 2012 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
    NF EN 60674-3-8 : 2012 AMD 1 2017 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
    13/30279156 DC : 0 BS EN 6101-2-012 ED.1 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
    CSA C22.2 No. 61010-2-012 : 2017 SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
    IEC 62327:2017 Radiation protection instrumentation - Hand-held instruments for the detection and identification of radionuclides and for the estimation of ambient dose equivalent rate from photon radiation
    EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
    BS EN 61010-2-012:2016 Safety requirements for electrical equipment for measurement, control and laboratory use Particular requirements for climatic and environmental testing and other temperature conditioning equipment
    I.S. EN 61010-2-012:2016 SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
    I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-3-4:2001 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    I.S. EN 60068-3-4:2002 ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE - DAMP HEAT TESTS
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    I.S. EN 60674-3-8:2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
    EN 60674-3-8:2011/A1:2017 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011/A1:2016)
    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
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