CEI EN 60068-3-13 : 1ED 2017
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
13-03-2017
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Overview
5 Component soldering - Processes
6 Soldering tests
7 Soldering tests - Methods
8 Requirements and statistical character of results
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Specifies background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-86. Supersedes CEI EN 60068-2-44 which remains current and will be withdrawn on 17-06-2019. (03/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-3-13:2016 | Identical |
| EN 60068-3-13:2016 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| EN 62137-3:2012 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 60068-2-83 : 2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
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