CEI EN 60068-3-13 : 1ED 2017
Current
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
Published date
01-02-2017
Publisher
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Overview
5 Component soldering - Processes
6 Soldering tests
7 Soldering tests - Methods
8 Requirements and statistical character of results
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
This Standard completely replaces IEC 60068-2-44:1996-09, which remains applicable until 17 June 2019.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-86. Supersedes CEI EN 60068-2-44 which remains current and will be withdrawn on 17-06-2019. (03/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-3-13:2016 | Identical |
| EN 60068-3-13:2016 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| EN 62137-3:2012 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| EN 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
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