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CLC/TS 50466:2006

Current

Current

The latest, up-to-date edition.

Long duration storage of electronic components - Specification for implementation

Published date

12-05-2006

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1 General
2 Normative references
3 Storage decision criteria
  3.1 Advantages of storage
       3.1.1 Technical simplicity - Rapidity
       3.1.2 Solution durability
       3.1.3 Preventive storage
  3.2 Hazards - Drawbacks
       3.2.1 Generic aging hazard
       3.2.2 Poor stock dimensioning
       3.2.3 Incorrect control of reliability during storage
       3.2.4 Freezing equipment functionalities
  3.3 Storage cost (Annex C)
  3.4 Decision criteria
4 Purchasing procurement
  4.1 List of components
  4.2 Quantity of components to be stored
       4.2.1 Production stock
       4.2.2 Field service stock
  4.3 When is it worth keeping in stock?
  4.4 Procurement recommendations
5 Technical validation of the components
  5.1 Purpose
  5.2 Relevant field
  5.3 Test selection criteria
  5.4 Measurements and tests
       5.4.1 Sampling
       5.4.2 Visual examination, sealing, solderability
       5.4.3 Compliance with the electrical specifications
             5.4.3.1 Measurement of electrical parameters
             5.4.3.2 Temperature impact
       5.4.4 Assessment of the supplied batch reliability
       5.4.5 Manufacturing control check (technological analysis)
  5.5 Sanction
6 Conditioning and storage
  6.1 Type of environment
  6.2 Elementary storage unit
  6.3 Stock management
  6.4 Redundancy
  6.5 Identification - Traceability
  6.6 Initial packaging
  6.7 Solderability
  6.8 Stabilization bake
  6.9 Storage conditions
       6.9.1 Storage area
       6.9.2 Temperature
       6.9.3 Temperature variations
       6.9.4 Relative humidity - Chemical attacks - Contamination
       6.9.5 Pressure
       6.9.6 Electrostatic discharges
       6.9.7 Vibrations - Mechanical impacts
       6.9.8 Electromagnetic field - Radiation
       6.9.9 Light
  6.10 Maintaining storage conditions
7 Periodic check of the components
  7.1 Objectives
  7.2 Periodicity
  7.3 Tests during periodic check
8 De-stocking
  8.1 Precautions
       8.1.1 Electrostatic discharges
       8.1.2 Mechanical impacts
  8.2 Inspection
9 Feedback
Annex A - Example related to components
  A.1 Example of a component list
  A.2 Data description
Annex B - Examples of periodic and/or destocking tests
Annex C - Parameters influencing the final price of the
          component storage
Annex D - Parameters influencing the quantity of the
          components to be stored
Annex E - Failure mechanisms - Hermetically encapsulated and
          non-encapsulated active components
Annex F - Failure mechanisms: GaAs components
Bibliography

This document, which is in line with IEC/PAS 62435 relating to the management of obsolescence of electronic components, is first of all a practical guide to methods of long duration storage (more than 5 years) which summarizes the existing practices in the industry.

Committee
CLC/SR 107
DocumentType
Technical Specification
PublisherName
European Committee for Standards - Electrical
Status
Current

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 190000:1995 Generic Specification: Monolithic integrated circuits

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