1 General
2 Normative references
3 Storage decision criteria
3.1 Advantages of storage
3.1.1 Technical simplicity - Rapidity
3.1.2 Solution durability
3.1.3 Preventive storage
3.2 Hazards - Drawbacks
3.2.1 Generic aging hazard
3.2.2 Poor stock dimensioning
3.2.3 Incorrect control of reliability during storage
3.2.4 Freezing equipment functionalities
3.3 Storage cost (Annex C)
3.4 Decision criteria
4 Purchasing procurement
4.1 List of components
4.2 Quantity of components to be stored
4.2.1 Production stock
4.2.2 Field service stock
4.3 When is it worth keeping in stock?
4.4 Procurement recommendations
5 Technical validation of the components
5.1 Purpose
5.2 Relevant field
5.3 Test selection criteria
5.4 Measurements and tests
5.4.1 Sampling
5.4.2 Visual examination, sealing, solderability
5.4.3 Compliance with the electrical specifications
5.4.3.1 Measurement of electrical parameters
5.4.3.2 Temperature impact
5.4.4 Assessment of the supplied batch reliability
5.4.5 Manufacturing control check (technological analysis)
5.5 Sanction
6 Conditioning and storage
6.1 Type of environment
6.2 Elementary storage unit
6.3 Stock management
6.4 Redundancy
6.5 Identification - Traceability
6.6 Initial packaging
6.7 Solderability
6.8 Stabilization bake
6.9 Storage conditions
6.9.1 Storage area
6.9.2 Temperature
6.9.3 Temperature variations
6.9.4 Relative humidity - Chemical attacks - Contamination
6.9.5 Pressure
6.9.6 Electrostatic discharges
6.9.7 Vibrations - Mechanical impacts
6.9.8 Electromagnetic field - Radiation
6.9.9 Light
6.10 Maintaining storage conditions
7 Periodic check of the components
7.1 Objectives
7.2 Periodicity
7.3 Tests during periodic check
8 De-stocking
8.1 Precautions
8.1.1 Electrostatic discharges
8.1.2 Mechanical impacts
8.2 Inspection
9 Feedback
Annex A - Example related to components
A.1 Example of a component list
A.2 Data description
Annex B - Examples of periodic and/or destocking tests
Annex C - Parameters influencing the final price of the
component storage
Annex D - Parameters influencing the quantity of the
components to be stored
Annex E - Failure mechanisms - Hermetically encapsulated and
non-encapsulated active components
Annex F - Failure mechanisms: GaAs components
Bibliography