EN 60749-15:2010/AC:2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
01-10-2020
12-01-2013
FOREWORD
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography
Specifies a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
| Committee |
SR 47
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NF EN 60749-15 : 2011 | Identical |
| IEC 60749-15:2010 | Identical |
| NBN EN 60749-15 : 2011 | Identical |
| NEN EN IEC 60749-15 : 2011 C11 2011 | Identical |
| I.S. EN 60749-15:2010 | Identical |
| PN EN 60749-15 : 2011 AC 2011 | Identical |
| SN EN 60749-15 : 2003 | Identical |
| UNE-EN 60749-15:2011 | Identical |
| BS EN 60749-15:2010 | Identical |
| CEI EN 60749-15 : 2012 | Identical |
| DIN EN 60749-15:2011-06 | Identical |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
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