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CENELEC
EN 60749-20-1 : 2009

EN 60749-20-1 : 2009

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

Published date

05-06-2009

Publisher

European Committee for Standards - Electrical

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General applicability and reliability considerations
  4.1 Assembly processes
      4.1.1 Mass reflow
      4.1.2 Localized heating
      4.1.3 Socketed components
      4.1.4 Point-to-point soldering
  4.2 Reliability
5 Dry packing
  5.1 Requirements
  5.2 Drying of SMDs and carrier materials before being
      sealed in MBBs
      5.2.1 Drying requirements - level A2
      5.2.2 Drying requirements - levels B2a to B5a
      5.2.3 Drying requirements - carrier materials
      5.2.4 Drying requirements - other
      5.2.5 Excess time between bake and bag
  5.3 Dry pack
      5.3.1 Description
      5.3.2 Materials
      5.3.3 Labels
      5.3.4 Shelf life
6 Drying
  6.1 Drying options
  6.2 Post exposure to factory ambient
      6.2.1 Floor life clock
      6.2.2 Any duration exposure
      6.2.3 Short duration exposure
  6.3 General considerations for baking
      6.3.1 High-temperature carriers
      6.3.2 Low-temperature carriers
      6.3.3 Paper and plastic container items
      6.3.4 Bakeout times
      6.3.5 ESD protection
      6.3.6 Reuse of carriers
      6.3.7 Solderability limitations
7 Use
  7.1 Floor life clock start
  7.2 Incoming bag inspection
      7.2.1 Upon receipt
      7.2.2 Component inspection
  7.3 Floor life
  7.4 Safe storage
      7.4.1 Safe storage categories
      7.4.2 Dry pack
      7.4.3 Dry atmosphere cabinet
  7.5 Reflow
      7.5.1 Reflow categories
      7.5.2 Opened MBB
      7.5.3 Reflow temperature extremes
      7.5.4 Additional thermal profile parameters
      7.5.5 Multiple reflow passes
      7.5.6 Maximum reflow passes
  7.6 Drying indicators
      7.6.1 Drying requirements
      7.6.2 Excess humidity in the dry pack
      7.6.3 Floor life or ambient temperature/humidity exceeded
      7.6.4 Level B6 SMDs
Annex A (normative) - Symbol and labels for moisture-sensitive
        devices
Annex B (informative) - Board rework
Annex C (informative) Derating due to factory environmental
        conditions
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.

Committee
SR 47
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
CEI EN 62435-2 : 1ED 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
CEI EN 62435-1 : 1ED 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-39 : 2006 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 39: MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED FOR SEMICONDUCTOR COMPONENTS
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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