EN 60749-23:2004/A1:2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
04-03-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
4.1 Circuitry
4.1.1 Device schematic
4.1.2 Power
4.2 Device mounting
4.3 Power supplies and signal sources
4.4 Environmental chamber
5 Procedure
5.1 Stress duration
5.2 Stress conditions
5.2.1 Ambient temperature
5.2.2 Operating voltage
5.2.3 Biasing configurations
6 Cool-down
7 Measurements
8 Failure criteria
9 Summary
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Specifies the effects of bias conditions and temperature on solid state devices over time.
| Committee |
SR 47
|
| DocumentType |
Test Method
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60749-23 : 2005 AMD 1 2011 | Identical |
| NF EN 60749-23 : 2004 AMD 1 2012 | Identical |
| I.S. EN 60749-23:2004 | Identical |
| PN EN 60749-23 : 2006 AMD 1 2011 | Identical |
| UNE-EN 60749-23:2005 | Identical |
| BS EN 60749-23 : 2004 | Identical |
| NEN EN IEC 60749-23 : 2004 AMD 1 2011 | Identical |
| CEI EN 60749-23/A1 : 2012 | Identical |
| DIN EN 60749-23:2011-07 | Identical |
| IEC 60749-23:2004+AMD1:2011 CSV | Identical |
| BS EN 60749-23:2004+A1:2011 | Identical |
| BS EN IEC 61051-1:2018 | Identical |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| I.S. EN 60749-34:2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| BS EN 60749-34:2010 | Semiconductor devices. Mechanical and climatic test methods Power cycling |
| EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| CEI EN 60749-34 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| UNE-EN 60749-34:2011 | Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.