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CENELEC
EN IEC 60191-1:2018

EN IEC 60191-1:2018

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Published date

30-03-2018

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General rules for all drawings
5 Additional rules
6 Inter-conversion of inch and millimetre dimensions
  and rules for rounding off
7 Rules for coding
Annex A (informative) - Reference letter symbols
Annex B (informative) - Rules to specify the dimensions
        and positions of terminals on a base drawing
Annex C (normative) - General philosophy of flat base devices
Annex D (normative) - Special rules for SMD-packages
Annex E (informative) - Examples of semiconductor
         device drawings
Annex F (informative) - Former rules for rounding off
Annex G (informative) - Former rules for coding
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.

This edition includes the following significant technical changes with respect to the previous edition:

a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;

b) a definition of the term "stand-off" has been added;

c) the methods for locating the datum have been extended to be suitable for SMD-packages;

d) the visual identification of terminal position one for automatic handling has been clarified;

e) the rules for the drawing of terminals have been clarified;

f) Table A.1 has been completed with symbols specifically for SMD-packages;

g) Annex B "Standardization philosophy" has been deleted;

h) a normative Annex with special rules for SMD-packages has been added;

i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

Committee
CLC/TC 47X
DevelopmentNote
Supersedes & Redesignates EN 60191-1. (04/2018)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
ISO 5459:2011 Geometrical product specifications (GPS) — Geometrical tolerancing — Datums and datum systems
IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
EN 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
EN 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
ISO 261:1998 ISO general purpose metric screw threads — General plan
ISO 370:1975 Toleranced dimensions Conversion from inches into millimetres and vice versa
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
ISO 263:1973 ISO inch screw threads General plan and selection for screws, bolts and nuts Diameter range 0,06 to 6 in
IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

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