I.S. EN 61188-5-4:2007
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
Hardcopy , PDF
English
01-01-2007
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Packaging
3.4 Process considerations
4 Small outlined J packages (SOJ)
4.1 Component description
4.2 Component dimensions
4.3 Solder joint fillet design
4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Describes the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61188-5-4:2007 | Identical |
| IEC 61188-5-4:2007 | Identical |
| EN 61188-5-4 : 2007 | Identical |
| DIN EN 61188-5-4:2008-07 | Identical |
| NF EN 61188-5-4 : 2016 | Identical |
| EN 60286-5:2004/A1:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
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