I.S. EN 61190-1-1:2002
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
Hardcopy , PDF
English
01-01-2002
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
4.1 Conflict
4.2 Flux classification and testing
4.2.1 Standard classification for products
4.2.2 Composition
4.2.3 Activity
4.2.4 Flux characterization test methods
4.2.5 Qualification
4.2.6 Quality conformance
4.2.7 Performance
4.2.8 Labelling
5 Quality assurance provisions
5.1 Responsibility for inspection
5.1.1 Responsibility for compliance
5.1.2 Test equipment and inspection facilities
5.1.3 Inspection conditions
5.2 Classification of inspections
5.3 Materials inspection
5.4 Qualification inspection
5.4.1 Sample size
5.4.2 Inspection routine
5.5 Performance inspection
5.6 Quality conformance
5.6.1 Sampling plan
5.6.2 Rejected lots
5.7 Preparation of fluxes for testing
5.7.1 Flux form for test
5.7.2 Liquid fluxes
5.7.3 Solid fluxes
5.7.4 Paste flux
5.7.5 Solder paste
5.7.6 Other materials
6 Preparation for delivery
6.1 Preservation-packing and packaging
7 Additional information
7.1 Flux activity
7.2 Flux and cleaning relationship
7.3 Ordering data
Annex A (normative)
Bibliography
Describes general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61190-1-1:2002 | Identical |
| IEC 61190-1-1:2002 | Identical |
| NF EN 61190-1-1 : 2002 | Identical |
| DIN EN 61190-1-1:2003-01 | Identical |
| EN 61190-1-1:2002 | Identical |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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