I.S. EN 61709:2017
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
Hardcopy , PDF
12-12-2019
English
01-01-2017
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) - Failure modes of components
Annex B (informative) - Thermal model for semiconductors
Annex C (informative) - Failure rate prediction
Annex D (informative) - Considerations on mission profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design of a
data base on failure rates
Annex H (informative) - Potential sources of failure rate
data and methods of selection
Annex I (informative) - Overview of component classification
Annex J (informative) - Presentation of component reliability data
Annex K (informative) - Examples
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides guidance on the use of failure rate data for reliability prediction of electric components used in equipment.
DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
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DocumentType |
Standard
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Pages |
264
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PublisherName |
National Standards Authority of Ireland
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Status |
Superseded
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SupersededBy |
Standards | Relationship |
NF EN 61709 : 2017 | Identical |
BS EN 61709:2017 | Identical |
NBN EN 61709 : 2011 | Identical |
EN 61709:2017 | Identical |
DIN EN 61709:2015-01 (Draft) | Identical |
SN EN 61709 : 2017 | Identical |
UNE-EN 61709:2014 | Identical |
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IEC 60050-151:2001 | International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices |
IEC 61360-4:2005 | Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes |
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IEC 60721-3-5:1997 | Classification of environmental conditions - Part 3: Classificationof groups of environmental parameters and their severities -Section 5: Ground vehicle installations |
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ISO 10303-31:1994 | Industrial automation systems and integration Product data representation and exchange Part 31: Conformance testing methodology and framework: General concepts |
IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
IEC 61360-1:2017 | Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
IEC 60650:1979 | Analogue counting ratemeters. Characteristics and test methods |
ISO 10303-11:2004 | Industrial automation systems and integration — Product data representation and exchange — Part 11: Description methods: The EXPRESS language reference manual |
IEC 61810-2:2017 | Electromechanical elementary relays - Part 2: Reliability |
IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
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IEC 61810-2-1:2017 | Electromechanical elementary relays - Part 2-1: Reliability - Procedure for the verification of B<sub>10</sub> values |
IEC 60747-12-2:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems |
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IEC TR 60943:1998+AMD1:2008 CSV | Guidance concerning the permissible temperature rise for parts of electrical equipment, in particular for terminals |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
MIL-C-18312 Revision G:2013 | CAPACITOR, FIXED, METALLIZED (PAPER-PLASTIC, OR PLASTIC FILM) DIELECTRIC, DIRECT CURRENT (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR |
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV | Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
EN 300 019-1-8 : 2.1.4 | ENVIRONMENTAL ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT; PART 1-8: CLASSIFICATION OF ENVIRONMENTAL CONDITIONS; STATIONARY USE AT UNDERGROUND LOCATIONS |
IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
IEC 61710:2013 | Power law model - Goodness-of-fit tests and estimation methods |
ETS 300 200019-1-3 : 20001 | EQUIPMENT ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT - CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - STATIONARY USE AT WEATHERPROTECTED LOCATIONS |
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