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I.S. EN 61709:2017

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION

Available format(s)

Hardcopy , PDF

Superseded date

12-12-2019

Language(s)

English

Published date

01-01-2017

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€139.00
Excluding VAT

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) - Failure modes of components
Annex B (informative) - Thermal model for semiconductors
Annex C (informative) - Failure rate prediction
Annex D (informative) - Considerations on mission profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design of a
        data base on failure rates
Annex H (informative) - Potential sources of failure rate
        data and methods of selection
Annex I (informative) - Overview of component classification
Annex J (informative) - Presentation of component reliability data
Annex K (informative) - Examples
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides guidance on the use of failure rate data for reliability prediction of electric components used in equipment.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
264
PublisherName
National Standards Authority of Ireland
Status
Superseded
SupersededBy

Standards Relationship
NF EN 61709 : 2017 Identical
BS EN 61709:2017 Identical
NBN EN 61709 : 2011 Identical
EN 61709:2017 Identical
DIN EN 61709:2015-01 (Draft) Identical
SN EN 61709 : 2017 Identical
UNE-EN 61709:2014 Identical

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IEC 60319:1999 Presentation and specification of reliability data for electronic components
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
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IEC 61649:2008 Weibull analysis
IEC 62741:2015 Demonstration of dependability requirements - The dependability case
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IEC 60050-151:2001 International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices
IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
IEC 60605-6:2007 Equipment reliability testing - Part 6: Tests for the validity and estimation of the constant failure rate and constant failure intensity
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IEC 60721-3-7:1995+AMD1:1996 CSV Classification of environmental conditions - Part 3-7: Classification of groups of environmental parameters and their severities - Portable and non-stationary use
IEC 60721-3-5:1997 Classification of environmental conditions - Part 3: Classificationof groups of environmental parameters and their severities -Section 5: Ground vehicle installations
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ISO 10303-31:1994 Industrial automation systems and integration Product data representation and exchange Part 31: Conformance testing methodology and framework: General concepts
IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
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IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
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IEC 60747-12-2:1995 Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems
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IEC TR 60943:1998+AMD1:2008 CSV Guidance concerning the permissible temperature rise for parts of electrical equipment, in particular for terminals
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MIL-C-18312 Revision G:2013 CAPACITOR, FIXED, METALLIZED (PAPER-PLASTIC, OR PLASTIC FILM) DIELECTRIC, DIRECT CURRENT (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
EN 300 019-1-8 : 2.1.4 ENVIRONMENTAL ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT; PART 1-8: CLASSIFICATION OF ENVIRONMENTAL CONDITIONS; STATIONARY USE AT UNDERGROUND LOCATIONS
IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
IEC 61710:2013 Power law model - Goodness-of-fit tests and estimation methods
ETS 300 200019-1-3 : 20001 EQUIPMENT ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT - CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - STATIONARY USE AT WEATHERPROTECTED LOCATIONS
IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles

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