I.S. EN 62435-1:2017
Current
The latest, up-to-date edition.
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
Hardcopy , PDF
English
01-01-2017
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms definitions and abbreviated terms
4 Purpose of long-term storage
5 Logistics
6 Storage considerations for devices after
card (or other) attachment
7 Handling
8 Inspection
9 Inventory control process
10 Transportation
11 Lead finishes
12 Kitting and lot control
13 Validation
14 Unplanned storage and types of storage
15 Other things to store in addition to the components
16 Storage facility
17 Policies
18 Legislation and environmental issues
Annex A (informative) - Example checklist for project
managers
Annex B (normative) - Example checklist for long-term
storage facilities
Annex C (informative) - Example of a component list
Annex D (informative) - Examples of periodic and/or
de-stocking tests
Annex E (informative) - Parameters influencing the
quantity of components to be stored
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
80
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62435-1:2017 | Identical |
| IEC 62435-1:2017 | Identical |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 62402:2007 | Obsolescence management - Application guide |
| IPC 1601 : 0 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.