13/30283837 DC : 0
|
BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE |
18/30373170 DC : 0
|
BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
I.S. EN 61188-5-2:2003
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
I.S. EN 140402-801:2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
EN 140400:2003
|
Sectional specification: Fixed low power surface mount (SMD) resistors |
EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
EN 60127-4:2005/A2:2013
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
EN 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
EN 140402:2015/A1:2016
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 60115-8-1:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
I.S. EN 140402:2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
BS EN 60127-4 : 2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
IEC 60115-8-1:2014
|
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
CEI EN 60115-8-1 : 2016
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
NF EN 60115-8-1 : 2016
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
PD IEC/TR 63091:2017
|
Study for the derating curve of surface mount fixed resistors. Derating curves based on terminal part temperature |
09/30209389 DC : 0
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BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
IEC TR 63091:2017
|
Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature |
14/30317306 DC : 0
|
BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 140400:2003
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION - FIXED LOW POWER SURFACE MOUNT (SMD) RESISTORS |
BS EN 140402 : 2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 140400:2004
|
SECTIONAL SPECIFICATION: FIXED LOW POWER SURFACE MOUNTING (SMD) RESISTORS |
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
BS EN 60115-8-1:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
IEC TS 62668-2:2016
|
Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
BS EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
PD IEC/TS 62668-2:2016
|
PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
I.S. EN 60127-4:2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
BS EN 61188-5-2:2003
|
PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
EN 60115-8-1:2015
|
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |