• IEC 60115-8:2009

    Current The latest, up-to-date edition.

    Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  26-01-2009

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. The major technical changes with regard to the first edition are the following:
    - introduction of a product classification based on application requirements;
    - extension of the list of styles and dimensions;
    - use of an extended scope of stability class definitions;
    - extension of the lists of preferred values of ratings;
    - inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
    - inclusion of a new set of severities for a shear test;
    - inclusion of definitions for a test board;
    - replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
    - inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
    - inclusion of requirements applicable to 0 ohm resistors (jumpers).

    General Product Information - (Show below) - (Hide below)

    Committee TC 40
    Development Note Stability Date: 2018. (10/2012) A Bilingual edition has been published. (01/2013)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    13/30283837 DC : 0 BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE
    18/30373170 DC : 0 BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    EN 140400:2003 SECTIONAL SPECIFICATION - FIXED LOW POWER SURFACE MOUNT (SMD) RESISTORS
    EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 61188-5-2 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    NF EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS PD IEC TR 63091 : 2017 STUDY FOR THE DERATING CURVE OF SURFACE MOUNT FIXED RESISTORS - DERATING CURVES BASED ON TERMINAL PART TEMPERATURE
    09/30209389 DC : 0 BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
    IEC TR 63091:2017 Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS EN 140400 : 2003 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION - FIXED LOW POWER SURFACE MOUNT (SMD) RESISTORS
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140400:2004 SECTIONAL SPECIFICATION: FIXED LOW POWER SURFACE MOUNTING (SMD) RESISTORS
    IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
    BS EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    BS EN 140402-801 : 2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    BS PD IEC TS 62668-2 : 2016 PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    BS EN 61188-5-2 : 2003 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G (IEC 60115-8-1:2014, MODIFIED)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
    IEC Q 01 : 5.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
    IEC 60410:1973 Sampling plans and procedures for inspection by attributes
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC TR 60440:1973 Method of measurement of non-linearity in resistors
    IEC 60062:2016 Marking codes for resistors and capacitors
    IEC 61340-3-1:2006 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
    IEC 60063:2015 Preferred number series for resistors and capacitors
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60060-1:2010 High-voltage test techniques - Part 1: General definitions and test requirements
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
    IEC 60195:2016 Method of measurement of current noise generated in fixed resistors
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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