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IEC 60748-11:1990

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

20-12-1990

€244.32
Excluding VAT

FOREWORD
PREFACE
Clause
1 Scope
2 General
   2.1 Related documents
   2.2 Recommended values of temperatures
   2.3 Recommended values of voltages
   2.4 Definitions related to manufacturing operations
3 Subcontracting
4 Primary stage of manufacture
   4.1 Bipolar devices
   4.2 Unipolar devices
5 Quality assessment procedures
   5.1 Qualification approval procedures
   5.2 Capability approval procedures
6 Structural similarity procedures
   6.1 General rules
   6.2 Test dependent criteria for structural similarity
        - Table I
7 Groups and sub-groups
   Table II - Group A: Lot by lot
   Table III - Group B: Lot by lot
   Table IV - Group C: Periodic tests
   Table V - Group D
8 Screening
   Table VI - Screening
9 Sampling requirements
   Table VII - Sampling requirements for Group A tests
   Table VIII - Sampling requirements for Group B, C
   and D tests in which LTPD shall be used
10 Terminal identification
11 Additional information (under consideration)
12 Test and measurement procedures
   12.1 Electrical measuring methods
   12.2 Mechanical and climatic test methods
   12.3 Electrical endurance tests
   12.4 Accelerated test procedures
   12.5 Correlated measurements
APPENDIX A - Guidance and format for drafting blank
             detail specifications

Applies to encapsulated semiconductor integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. Gives details of the Quality Assessment Procedures, the inspection requirements, screening sequences, sampling requirements, test and measurement procedures required for the assessment of semiconductor integrated circuits, including digital, analogue and interface circuits.

DevelopmentNote
Supersedes IEC 60186B. (07/2004) Stability Date: 2021. (11/2017)
DocumentType
Standard
Pages
79
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

BS QC750116(2000) : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
BS IEC 60747-4.2 : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
BS IEC 60748-5:1997 Semiconductor devices. Integrated circuits Semicustom integrated circuits
IEC 60748-2-12:2001 Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
BS QC 790109:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU
BS IEC 60748-2.12 : 2001 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDS)
IEC 60747-4-2:2000 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
00/203087 DC : DRAFT AUG 2000 IEC 62147 - INTEGRATED CIRCUITS - UNIFIED QUALIFICATION STANDARD TO MEET IECQ AND END-USER CERTIFICATION

IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60617-13:1993 Graphical symbols for diagrams - Part 13: Analogue elements
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60748-3:1986 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
IEC 60748-4:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
IEC 60617-12:1997 Graphical symbols for diagrams - Part 12: Binary logic elements

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