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IEC 60749-14:2003

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

07-08-2003

€83.17
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62184. (08/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
DocumentType
Standard
Pages
27
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

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IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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