IEC 60749-4:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
03-03-2017
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 HAST test - General remarks
5 Test apparatus
6 Test conditions
7 Procedure
8 Failure criteria
9 Safety
10 Summary
IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:
a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
c) allowance of additional time-to-test delay or return-to-stress delay.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62177 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| PN EN 60749-4 : 2017 | Identical |
| UNE-EN 60749-4:2017 | Identical |
| BS EN 60749-4:2002 | Identical |
| NEN EN IEC 60749-4 : 2017 | Identical |
| EN 60749-4:2017 | Identical |
| CEI EN 60749-4 : 2004 | Identical |
| DIN EN 60749-4:2016-06 (Draft) | Identical |
| UNE-EN 60749-4:2003 | Identical |
| BS EN 60749-4:2017 | Identical |
| SAC GB/T 4937-4 : 2012 | Identical |
| NF EN 60749-4 : 2002 | Identical |
| PNE-FprEN 60749-4:2016 | Identical |
| BS EN 60745-2-4:2009+A11:2011 | Identical |
| BS EN 60749-5:2017 | Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| BS EN 60749-30 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| CEI EN 60749-5 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
| NF EN 60749-5 : 2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| I.S. EN 60749-30:2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| I.S. EN 60749-5:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST (IEC 60749-5:2017) |
| PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
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