IEC 61249-2-35:2008
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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English - French
27-11-2008
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Resin system
3.2 Metal foil
3.3 Reinforcement
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.1.1 Indentations (pits and dents)
6.1.2 Wrinkles
6.1.3 Scratches
6.1.4 Raised areas
6.1.5 Surface waviness
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
6.5 Properties related to the copper foil bond
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes
6.8.1 Typical sheet sizes
6.8.2 Tolerances for sheet sizes
6.9 Cut panels
6.9.1 Cut panel sizes
6.9.2 Size tolerances for cut panels
6.9.3 Rectangularity of cut panels
7 Non-electrical properties of the base material after
complete removal of the copper foil
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
7.7 Decomposition temperature
7.8 Thermal resistance
7.9 Z-axis expansion
8 Quality assurance
8.1 Quality system
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and
conformance inspection
Bibliography
IEC 61249-2-35:2008 gives requirements for properties of modified brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-2-35 : 2009 | Identical |
| NEN EN IEC 61249-2-35 : 2009 | Identical |
| I.S. EN 61249-2-35:2009 | Identical |
| PN EN 61249-2-35 : 2009 | Identical |
| UNE-EN 61249-2-35:2009 | Identical |
| BS EN 61249-2-35:2009 | Identical |
| CEI EN 61249-2-35 : 2010 | Identical |
| EN 61249-2-35:2009 | Identical |
| DIN EN 61249-2-35:2009-07 | Identical |
| EN 61249-4-15 : 2009 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 61249-4-15:2009 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
| BS EN 61249-4-15:2009 | Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| CEI EN 61249-4-15 : 2010 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 61249-4-15:2009 | Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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