IEC 61760-4:2015
Current
The latest, up-to-date edition.
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
19-05-2015
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General information
5 Assessment of moisture sensitivity
6 Test procedure
7 Requirements to packaging and labelling
8 Handling of moisture sensitive devices
9 Drying
Annex A (informative) - Moisture sensitivity of assemblies
Annex B (informative) - Mass/gain loss analysis
Annex C (informative) - Baking of devices
Annex D (normative) - Moisture sensitivity labels
Bibliography
IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.
| Committee |
TC 91
|
| DevelopmentNote |
Stability date: 2019. (05/2015)
|
| DocumentType |
Standard
|
| Pages |
74
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| ONORM OVE EN 61760-4 : 2016 | Identical |
| BS EN 61760-4 : 2015 | Identical |
| NEN EN IEC 61760-4 : 2015 | Identical |
| NBN EN 61760-4 : 2015 | Identical |
| PN EN 61760-4 : 2015 | Identical |
| CEI EN 61760-4 : 2016 | Identical |
| NF EN 61760-4 : 2015 | Identical |
| DIN EN 61760-4:2016-03 | Identical |
| JIS C 61760-4:2016 | Identical |
| UNE-EN 61760-4:2015 | Identical |
| EN 61760-4:2015/A1:2018 | Identical |
| PNE-FprEN 61760-4 | Identical |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| I.S. EN 62090:2017 | PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| BS EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| 16/30333617 DC : 0 | BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| MIL-PRF-131 Revision K:2005 | BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| MIL-PRF-27401 Revision G:2013 | Propellant Pressurizing Agent, Nitrogen |
| ISO 62:2008 | Plastics Determination of water absorption |
| ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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