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IEC 62137-1-3:2008
Current
The latest, up-to-date edition.
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
27-11-2008
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Reflow soldering oven
5.2 Drop impact test equipment
5.3 Test substrate
5.4 Solder alloy
5.5 Solder paste
5.6 Specimen components
5.7 Strain gauge
6 Mounting method
7 Test method and procedure, and judgment conditions
7.1 Test procedure
7.2 Judgment conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) Drop impact test equipment
Annex B (normative) Test method and procedure
Annex C (informative) An example of test equipment and
procedure
Annex D (informative) An example of strain gauge attachment
procedure
Bibliography
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