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IEC 62258-2:2011

Current

Current

The latest, up-to-date edition.

Semiconductor die products - Part 2: Exchange data formats

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

25-05-2011

€358.68
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals and usage
6 DDX file format and file format rules
7 DDX file content
8 Definitions of DEVICE block parameters
Annex A (informative) - An example of a DDX DEVICE block
Annex B (informative) - Groups and Permutation
Annex C (informative) - A Typical CAD view from the DDX file
                        block example given in Annex A
Annex D (informative) - Properties for Simulation
Annex E (informative) - TERMINAL and TERMINAL_TYPE
                        graphical usage for CAD/CAM systems
Annex F (informative) - Cross-reference with IEC 61360-4
Annex G (informative) - Notes on VERSION and NAME
                        parameters
Annex H (informative) - Notes on WAFER parameters
Annex I (informative) - Additional notes
Annex J (informative) - DDX Version history
Annex K (informative) - Parse Control

IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

This publication is to be read in conjunction with IEC 62258-1:2009.

Committee
TC 47
DevelopmentNote
To be read in conjunction with IEC 62258-1. (06/2005) Stability Date: 2015. (10/2012)
DocumentType
Standard
Pages
146
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

CEI CLC/TR 62258-7 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
06/30123954 DC : DRAFT MAR 2006
BS EN 62258-5:2006 Semiconductor die products Requirements for information concerning electrical simulation
04/30110525 DC : DRAFT MARCH 2004 IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
BS EN 62258-1:2010 Semiconductor die products Procurement and use
06/30146849 DC : DRAFT FEB 2006 IEC TR 62258-7 - SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
S.R. CLC/TR 62258-4:2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012 (EQV))
05/30130553 DC : DRAFT MAR 2005 IEC 62258-5 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
PD CLC/TR 62258-3:2007 Semiconductor die products Recommendations for good practice in handling, packing and storage
PD IEC/TR 62258-4:2007 Semiconductor die products Questionnaire for die users and suppliers
S.R. TR 62258-7:2007 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
I.S. EN 62258-5:2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
CEI CLC/TR 62258-8 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CEI EN 62258-5 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
PD CLC/TR 62258-4:2013 Semiconductor die products Questionnaire for die users and suppliers
CEI CLC/TR 62258-4 : 2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
PD IEC/TR 62258-7:2007 Semiconductor die products XML schema for data exchange
IEC TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
S.R. TR 62258-4:2007 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
PD IEC/TR 62258-8:2008 Semiconductor die products EXPRESS model schema for data exchange
05/30130559 DC : DRAFT MAR 2005 IEC 62258-6 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
BS PD IEC TR 62258-3 : 2005 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
05/30127455 DC : DRAFT JAN 2005 IEC 62258-4 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
BS EN 62258-6:2006 Semiconductor die products Requirements for information concerning thermal simulation
CEI EN 62258-6 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
I.S. EN 62258-6:2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
S.R. CLC/TR 62258-8:2008 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
ISO 6093:1985 Information processing Representation of numerical values in character strings for information interchange
ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
ISO 10303-21:2002 Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure

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