IEC 62435-5:2017
Current
The latest, up-to-date edition.
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
20-01-2017
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Storage requirements
5 Long-term storage failure mechanisms
6 LTS concerns, method, verification and limitations
7 Deterioration mechanisms specific to bare die
and wafers
8 Specific handling concerns
Annex A (informative) - Audit checklist
Bibliography
IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.
| Committee |
TC 47
|
| DevelopmentNote |
Stability Date: 2022. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 62435-5 : 2017 | Identical |
| NF EN 62435-5 : 2017 | Identical |
| NEN EN IEC 62435-5 : 2017 | Identical |
| PN EN 62435-5 : 2017 | Identical |
| SN EN 62435-5 : 2017 | Identical |
| DIN EN 62435-5 : 2013 | Identical |
| VDE 0884-135-5 : 2017 | Identical |
| UNE-EN 62435-5:2017 | Identical |
| BS EN 62435-5:2017 | Identical |
| CEI EN 62435-5 : 1ED 2017 | Identical |
| EN 62435-5:2017 | Identical |
| PNE-FprEN 62435-5 | Identical |
| IEC TS 62239-2:2017 | Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| PD IEC/TS 62239-2:2017 | Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 61340-2-1:2015 | Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-22:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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