IEC PAS 62435:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Electronic components - Long-duration storage of electronic components - Guidance for implementation
Hardcopy , PDF
20-01-2017
English
26-09-2005
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Storage decision criteria
3.1 Advantages
3.1.1 Technical simplicity - Rapidity
3.1.2 Solution durability
3.1.3 Preventive storage
3.2 Hazards - Drawbacks
3.2.1 Generic aging hazard
3.2.2 Poor stock dimensioning
3.2.3 Incorrect control of reliability during storage
3.2.4 Freezing equipment functionalities
3.3 Storage cost
3.4 Decision criteria
4 Purchasing - Procurement
4.1 List of components
4.2 Quantity of components to be stored
4.2.1 Production stock
4.2.2 Field service stock
4.3 When is it worth keeping in stock?
4.4 Procurement recommendations
5 Technical validation of the components
5.1 Purpose
5.2 Relevant field
5.3 Test selection criteria
5.4 Measurements and tests
5.4.1 Sampling
5.4.2 Visual examination, sealing, solderability
5.4.3 Compliance with the electrical specifications
5.4.4 Assessment of the supplied batch reliability
5.4.5 Manufacturing control check (technological analysis)
5.5 Sanction
6 Conditioning and storage
6.1 Type of environment
6.2 Elementary storage unit
6.3 Stock management
6.4 Redundancy
6.5 Identification - Traceability
6.6 Initial packaging
6.7 Stabilization bake
6.8 Storage conditions
6.8.1 Storage area
6.8.2 Temperature
6.8.3 Temperature variations
6.8.4 Relative humidity - Chemical attacks - Contamination
6.8.5 Pressure
6.8.6 Electrostatic discharges
6.8.7 Vibration - Mechanical impacts
6.8.8 Electromagnetic field - Radiation
6.8.9 Light
6.9 Maintaining storage conditions
7 Periodic check of the components
7.1 Objectives
7.2 Periodicity
7.3 Tests during periodic check
8 Destocking
8.1 Precautions
8.1.1 Electrostatic discharges
8.1.2 Mechanical impacts
8.2 Inspection
9 Feedback
Annex A (informative) Example of a component list
Annex B (informative) Examples of periodic and/or destocking
tests (1/3)
Annex C (informative) Parameters influencing the final price
of the component storage
Annex D (informative) Parameters influencing the quantity of
components to be stored
Annex E (normative) Failure mechanisms: Encapsulated and
non-encapsulated active components
Annex F (normative) Failure mechanisms: GaAs components
This PAS applies to the long-duration storage of electronic components.Although it has always existed to some extent, obsolescence of electronic components, and particularly integrated circuits, has become increasingly intense over the last few years. Indeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as those encountered in the aeronautical field, the railway industry or the energy sector.The many solutions enabling obsolescence to be resolved are now identified. However, selecting one of these solutions must be preceded by a case-by-case technical and economic feasibility study, depending on whether storage is envisaged for field service or production, for example: - remedial storage as soon as components are no longer marketed- preventive storage anticipating declaration of obsolescenceTaking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence must often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent.The technical risks of this solution are, a priori, fairly low. However, it requires the perfect mastery of the implemented process, and especially of the storage environment, although this mastery becomes critical when it comes to long-term storage. All handling, protection, storage and test operations must be performed according to the state of the art.
DevelopmentNote |
Stability Date: 2015. (10/2012)
|
DocumentType |
Miscellaneous Product
|
Pages |
30
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
Standards | Relationship |
DD IEC/PAS 62435:2005 | Identical |
NEN NPR IEC/PAS 62435 : 2005 | Identical |
IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
IEC 61709:2017 RLV | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
EN 62550:2017 | Spare parts provisioning |
CLC/TS 50466:2006 | Long duration storage of electronic components - Specification for implementation |
PD IEC/TS 62668-1:2016 | Process management for avionics. Counterfeit prevention Avoiding the use of counterfeit, fraudulent and recycled electronic components |
BS EN 62550:2017 | Spare parts provisioning |
PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
I.S. EN 61709:2017 | ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
DD CLC/TS 50466:2006 | Long duration storage of electronic components. Specification for implementation |
EN 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
BS EN 61709:2017 | Electric components. Reliability. Reference conditions for failure rates and stress models for conversion |
IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
IEC 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
IEC 62550:2017 | Spare parts provisioning |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC TS 61340-5-2:1999 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
AS/NZS IEC 62550:2019 | Spare Parts Provisioning |
EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
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