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IPC 2222 GERMAN : A

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

Withdrawn date

14-09-2023

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Dieses Normenwerk legt die allgemeinen Anforderungen für das Design on Leiterplatten aus organischen Materialien sowie anderen Formen der Bauelementbefestigung oder Verbindungsstrukturen fest. Die organischen Materialien können homogen, verstärkt oder in Kombination mit anorganischen Materialien erarbeitet werden, und die Verbindungen können aus einer Lage, zwei oder mehreren Lagen bestehen.

DevelopmentNote
Also available in CD-ROM format. (09/2010)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2152 : 0 STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4411 : A SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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