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  • IPC 2222 GERMAN : A

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

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    Withdrawn date:  14-09-2023

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    Published date: 

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Dieses Normenwerk legt die allgemeinen Anforderungen für das Design on Leiterplatten aus organischen Materialien sowie anderen Formen der Bauelementbefestigung oder Verbindungsstrukturen fest. Die organischen Materialien können homogen, verstärkt oder in Kombination mit anorganischen Materialien erarbeitet werden, und die Verbindungen können aus einer Lage, zwei oder mehreren Lagen bestehen.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. (09/2010)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 2152 : 0 STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC 4411 : A SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
    IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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