• There are no items in your cart

IPC 2615 : 0

Current

Current

The latest, up-to-date edition.

PRINTED BOARD DIMENSIONS AND TOLERANCES

Available format(s)

Hardcopy

Language(s)

English

Published date

01-07-2000

1 PURPOSE
      1.1 Scope
      1.2 General
      1.3 References
2 TERMS AND DEFINITIONS
      2.1 Actual Size
      2.2 Basic Dimension
      2.3 Bilateral Tolerance
      2.4 Cumulative Tolerances
      2.5 Datum
      2.6 Datum Feature
      2.7 Datum Axis
      2.8 Datum Target
      2.9 Dependent of Size
      2.10 Dimension
      2.11 End Product (End Item)
      2.12 Fabrication Allowance
      2.13 Feature
      2.14 Feature of Size
      2.15 Fiducial
      2.16 Geometric Tolerance
      2.17 Limits of Size
      2.18 Least Material Condition (LMC)
      2.19 Maximum Material Condition (MMC)
      2.20 Positional Tolerance
      2.21 Reference Dimension
      2.22 Regardless of Feature Size (RFS)
      2.23 Simulated Datum
      2.24 Tolerance
      2.25 Tolerance, Statistical
      2.26 Toleranced Dimension
      2.27 True Position
      2.28 Undimensioned Drawing
      2.29 Unilateral Tolerance
      2.30 Virtual Condition
3 GEOMETRIC CHARACTERS AND SYMBOLS
      3.1 General
      3.2 Use of Notes to Supplement Symbols
      3.3 Symbol Construction
      3.4 Geometric Tolerance Symbols
      3.5 Feature Control Frame Placement
4 GENERAL RULES
      4.1 Maximum Material Condition Principle (MMC)
Effect of MMC
      4.2 Regardless of Feature Size
      4.3 Least Material Condition Principle
      4.4 Limits of Size
      4.5 Applicability of MMC, RFS, and LMC
5 DATUM REFERENCING
      5.1 General
      5.2 Datum Features
      5.3 Establishing Datums
      5.4 Datum Targets
6 TOLERANCES OF LOCATION
      6.1 General
      6.2 Positional Tolerancing
      6.3 Fundamental Explanation of Positional
             Tolerancing
      6.4 Feature Pattern Location
      6.5 Bi-directional Positional Tolerancing of
             Features
      6.6 Position of Non-Circular Features
      6.7 Undimensioned Drawings (Artwork)
7 TOLERANCES OF FORM, ORIENTATION, PROFILE
      7.1 General
      7.2 Form and Orientation Control
      7.3 Specifying Form and Orientation Tolerances
      7.4 Profile Control
Appendix A: FUNDAMENTAL DIMENSIONING AND TOLERANCING RULES
Appendix B: GENERAL TOLERANCING AND RELATED PRINCIPLES
Appendix C: DIMENSIONING FOR COMPUTER-AIDED DESIGN AND
             MANUFACTURING
Figure 3-1 - Datum Feature Symbol
Figure 3-2 - Examples of Datum Identification
Figure 3-3 - Basic Dimension Symbol
Figure 3-4 - Feature Control Frame
Figure 3-5 - Feature Control Frame Incorporated Datum Report
Figure 3-6 - Order of Precedence of Datum Reference
Figure 3-7 - Multiple Feature Control Frames
Figure 3-8 - Symbol for All Around
Figure 3-9 - Combined Feature Control Frame and Datum Feature
             Symbol
Figure 3-10 - Feature Control Frame Placement
Figure 4-1 - Positional Tolerancing at MMC
Figure 4-2 - Variations of Form Allowed By Size Tolerance
Figure 5-1 - Datum Reference Frame
Figure 5-2 - Datum Reference Frame to Printed Board
             Relationships
Figure 5-3 - Datum Reference Using Printed Board Edges
Figure 5-4 - Hole and Slot Establishing Secondary and
             Tertiary Datums
Figure 5-5 - Additional Datum Example
Figure 5-6 - Datum Feature Identification and Reference
Figure 5-7 - Secondary Datum Established By Internal Feature
Figure 5-8 - Datum Feature and Simulated Datum
Figure 5-9 - Virtual Condition of Datum Feature
Figure 5-10 - Part With Cylindrical Datum Features (a)
              primary datum feature K, which establishes a
              datum plane; and (b) secondary datum feature
              M, which establishes a datum axis
Figure 5-11 - Cylindrical Internal Datum Features
Figure 5-12 - Development of a Datum Reference Frame
Figure 5-13 - Pattern of Feature to Establish Secondary Datum
Figure 5-14 - Multiple Datum Reference Conditions
              (Rigid/Flex) Examples
Figure 5-15 - Referencing Datums in Feature Control Frames
Figure 5-16 - Datum Target Symbol
Figure 5-17 - Datum Target Point
Figure 5-18 - Dimensioning Datum Targets
Figure 5-19 - Primary Datum Plane Established
Figure 6-1 - Identifying Basic Dimensions
Figure 6-2 - Positional Tolerances With Datum Reference
Figure 6-3 - Positional Tolerancing
Figure 6-4 - Establishing Datums for True Position Location
Figure 6-5 - Basic Dimensioning Using Chain or Baseline Format
Figure 6-6 - Boundary for Surface of Hole at MMC
Figure 6-7 - Hole Axes in Relation to Positional Tolerance
             Zones
Figure 6-8 - Increase in Positional Tolerance Where Hole is
             Not at MMC
Figure 6-9 - Conventional Positional Tolerancing at MMC
Figure 6-10 - Regardless of Feature Size Applied to A Feature
              and A Datum
Figure 6-11 - Increase in Positional Tolerance Where Hole is
              not at LMC
Figure 6-12 - LMC Applied to A Pattern of Mounting Pins
Figure 6-13 - Multiple Patterns of Features
Figure 6-14 - Tolerance Zones for Patterns Shown in
Figure 6-13
Figure 6-15 - Multiple Patterns of Features, Separate
              Requirement
Figure 6-16 - Hole Patterns Located By Composite Positional
              Tolerancing
Figure 6-17 - Tolerance Zone for Three-Hole Hole Patterns
              Shown in Figure 6-16
Figure 6-18 - Bi-Directional Positional Tolerancing,
              Rectangular Coordinate Method
Figure 6-19 - Keying Slot Detail
Figure 6-20 - 'V' Groove
Figure 6-21 - Keying Slot Detail
Figure 7-1 - Application of A Profile of A Surface to A
             Contour
Figure 7-2 - Specifying Profile of A Surface All Around
Figure 7-3 - Specifying Different Profile Tolerance
Figure 7-4 - Profile Implementation
Figure 7-5 - Specifying A Controlled Radius
Figure 7-6 - Tolerancing An Angular Surface Using A
             Combination of Linear and Angular Dimensions
Figure 7-7 - Interpreting Angularity Tolerances
Figure 7-8 - 45 Degree Chamfer
Figure A-1 - Angular Units
Figure A-2 - Millimeter Dimensioning
Figure A-3 - Decimal Inch Dimensioning
Figure A-4 - Application of Dimensions
Figure A-5 - Grouping of Dimensions
Figure A-6 - Spacing of Dimensions
Figure A-7 - Staggered Dimensions
Figure A-8 - Dimension Line/Extension Line
Figure A-9 - Oblique Extension Lines
Figure A-10 - Breaks In Extension Lines
Figure A-11 - Point Location
Figure A-12 - Limited Length or Area Indication
Figure A-13 - Leader-Directed Dimension
Figure A-14 - Minimizing Leaders
Figure A-15 - Leader Directed to Circle
Figure A-16 - Reading Direction
Figure A-17 - Intermediate Reference Dimension
Figure A-18 - Radii
Figure A-19 - Radius With Locating Center
Figure A-20 - Radii With Unlocated Center
Figure A-21 - Dimensioning Chords, Arcs, and Angles
Figure A-22 - Fully Rounded Ends
Figure A-23 - Partially Rounded Ends
Figure A-24 - Rounded Corners
Figure A-25 - Circular Arc Outline
Figure A-26 - Coordinate or Offset Outline
Figure A-27 - Tabulated Outline
Figure A-28 - Round Holes
Figure A-29 - Slotted Holes
Figure A-30 - Equalized Chamfers
Figure A-31 - Chamfers at Other Than 90 degrees
Figure A-32 - Edge Card Connector
Figure A-33 - Rectangular Coordinate Dimension
Figure A-34 - Rectangular Coordinate Dimensions Without
              Dimension Lines
Figure A-35 - Polar Coordinate Dimensions
Figure A-36 - Repetitive Features and Dimensions
Figure A-37 - Equal Spacing of Features
Figure B-1 - Limit Dimensions
Figure B-2 - Plus or Minus Tolerances
Figure C-1 - Mathematical Quadrants
Figure C-2 - Locating A Circuit Pattern Using

Covers tolerancing and dimensioning of electronic packaging comprehensively and in-sync with other IPC printed board standards such as IPC-6021A and IPC-2221. Includes fundamental tolerancing and dimensioning rules, orientation and form tolerances, profile, and detailed geometric symbology. Encompasses over 100 new and revised illustrations. This document which is invaluable to the PWB designer will help manufacturers and board purchasers achieve the most manufacturable board designs.

DevelopmentNote
Supersedes IPC D 300. (07/2000) Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
175
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
DSCC 10013 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES
DSCC 10014:2012 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.