IPC 4104 : 1999
Current
The latest, up-to-date edition.
SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
Hardcopy
English
01-05-1999
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1 SCOPE
1.1 General
1.2 Designation System
1.3 Application Levels
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing and Materials
(ASTM)
2.3 Underwriters Laboratories (UL)
2.4 American National Standards Institute (ANSI)
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Specification Sheets
3.3 Manufacturer's Quality Profile
3.4 Qualification (Characterization) Testing
3.5 Verification of Material Supplier's Quality
System
3.6 Conflict
3.7 Materials
3.8 General Acceptability
3.9 Mechanical Requirements
3.10 Chemical Requirements
3.11 Electrical Requirements
3.12 Environmental Requirements
3.13 Non-Nutrient
3.14 Workmanship
3.15 Material Safety Data Sheets
3.16 Shelf Life
3.17 Marking
4 QUALITY ASSURANCE PROVISIONS
4.1 Quality System
4.2 Responsibility for Inspection
4.3 Qualification (Characterization) Testing
4.4 Quality Conformance Inspection
4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
5.1 Packaging
6 NOTES
6.1 Ordering Data
6.2 References
APPENDIX A
Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.
| DevelopmentNote |
Supersedes IPC JPCA 4104. (06/2002) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC TR 483 : 1991 | DIMENSIONAL STABILITY TESTING OF THIN LAMINATES - REPORT ON PHASE 1 AND PHASE 2 INTERNATIONAL ROUND ROBIN TEST PROGRAMS |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
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