
IPC 4821 : 0
Current
The latest, up-to-date edition.

SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
Hardcopy
English
01-05-2006
1 SCOPE
1.1 General
1.2 Designation System
1.2.1 Embedded Capacitor Passive Device
Designations
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing and Materials
(ASTM)
2.3 Underwriters Laboratories (UL)
2.4 National Conference of Standards Laboratories
(NCSL)
2.5 International Organization for Standardization
2.6 International Electrotechnical Commission
3 REQUIREMENTS
3.1 Terms and Definitions
3.1.1 Embedded Planar Capacitor
3.1.2 Embedded Discrete Capacitor
3.2 Specification Sheets
3.3 Supplier's Quality Profile
3.4 Qualification (Characterization) Testing
3.4.1 Material Qualification
3.5 Conformance Testing
3.5.1 Samples
3.5.2 Frequency
3.6 Verification of Supplier's Quality System
3.7 Conflict
3.8 Materials
3.8.1 Capacitor Materials in Laminate-Like Form
3.8.2 Capacitor Materials in Nonlaminate-Like
Form
3.8.3 Encapsulant Materials in Nonlaminate-Like
Form
3.8.4 Conductor/Termination Materials
3.9 General Acceptability
3.9.1 General Acceptability of Dielectric Materials
3.9.2 General Acceptability of Conductive Materials
3.9.3 Inspection
3.10 Visual Requirements
3.10.1 Visual Requirements of Laminate-Like
Capacitor Materials
3.10.2 Visual Requirements of Nonlaminate-Like
Capacitor Materials
3.11 Dimensional Requirements
3.11.1 Dimensional Requirements of Laminate-Like
Capacitor Materials
3.12 Mechanical Requirements
3.12.1 Mechanical Requirements of Laminate-Like
Capacitor Materials
3.12.2 Mechanical Requirements of Nonlaminate-Like
Capacitor Materials
3.13 Thermal Requirements
3.13.1 Thermal Requirements of Laminate-Like
Capacitor Materials
3.13.2 Thermal Requirements of Nonlaminate-Like
Capacitor Materials
3.14 Electrical Requirements
3.14.1 Electrical Requirements of Laminate-Like
Capacitor Materials Capacitance (TCC)
3.14.2 Electrical Requirements of Nonlaminate-Like
Capacitor Materials
3.15 Environmental Requirements
3.15.1 Environmental Requirements of Laminate-Like
Capacitor Materials
3.15.2 Environmental Requirements of Nonlaminate-like
Capacitor Materials
3.16 Workmanship
3.17 Material Safety Data Sheets
3.18 Shelf Life
3.19 Marking
4 QUALITY ASSURANCE PROVISIONS
4.1 Quality System
4.2 Responsibility for Inspection
4.2.1 Test Equipment and Inspection Facilities
4.2.2 Standard Laboratory Conditions
4.3 Qualification (Characterization) Testing
4.3.1 Samples
4.3.2 Structurally Similar Construction
4.3.3 Laboratory Equipment Tolerances
4.4 Quality Conformance Inspection
4.4.1 Frequency
4.4.2 Inspection of Product for Delivery
4.4.3 Acceptance Criteria
4.4.4 Rejected Lots
4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
5.1 Packing
6 NOTES
6.1 Ordering Data
6.2 Electrostatic Discharge (ESD) Testing
6.3 HiPot Test Method
Figures
Tables
Describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. Also provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials.
Committee |
D-52
|
DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
Pages |
34
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
IPC 2316 : 0 | DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS |
IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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