IPC 7094 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS
Hardcopy
13-09-2023
English
14-02-2018
1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS AND TECHNOLOGY OVERVIEW
4 FLIP CHIP TECHNOLOGY
5 FLIP CHIP POST FABRICATION PROCESSING
6 FLIP CHIP INTERCONNECTING SUBSTRATES
7 PACKAGE LEVEL STANDARDIZATION
8 SYSTEM LEVEL ISSUES
9 FLIP CHIP AND DIE SIZE DEVICE ASSEMBLY
10 REQUIREMENTS FOR BOARD AND MODULE
LEVEL RELIABILITY
11 RELIABILITY PREDICTION MODELING
12 VALIDATION AND QUALIFICATION TESTING
13 SUPPLY CHAIN ISSUES
APPENDIX A - Glossary
APPENDIX B - Acronyms
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