IPC 9502 : 0

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Current The latest, up-to-date edition.

PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS

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Published date: 01-04-1999

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 SCOPE
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 Electronic Industries Association
3 TERMS AND DEFINITIONS
4 APPLICATIONS AND OBJECTIVES
5 COMPONENT COMPATIBILITY REQUIREMENTS
   5.1 Process Compatibility
   5.2 Other Processes
6 PCB ASSEMBLY PROCESS COMPATIBILITY LIMITS
   6.1 235 degree C Oven Reflow Soldering Process
   6.2 220 degree C Reflow Solder Process
   6.3 Wave Solder TH 180 degree C Preheat
   6.4 Wave Solder TH 160 degree C Preheat
   6.5 Wave Solder SM 255 degree C - 130 degree C
        Spike
   6.6 Wave Solder SM 255 degree C - 100 degree C
        Spike
   6.7 Hand Solder TH & SM
   6.8 Vapor Phase 217-219 degree C Max
   6.9 Cleaning Process
   6.10 No Clean Process
Figures
Tables

Abstract - (Show below) - (Hide below)

The document describes manufacturing solder process limits that components subjected to IPS-9501, IPC-9504 and J-STD-020 would survive. Optimum conditions for assembly are not included, but rather guides to assure components are not damaged. The document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. The document is intended to complement other industry documents. Note: It does not address the increased temperature of lead-free solders.

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Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Current

Standards Referenced By This Book - (Show below) - (Hide below)

EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9501 : 0	PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC 9500 : 2003	ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
IPC 9504 : 0	ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC M 109 : LATEST	COMPONENTS HANDLING MANUAL
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9701 CHINESE : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

Standards Referencing This Book - (Show below) - (Hide below)

IPC 9503 : 0	MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC M 109 : LATEST	COMPONENTS HANDLING MANUAL
IPC HDBK 001 : E	HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC 9501 : 0	PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC 9504 : 0	ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)

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