1.0 SCOPE
1.1 Non-IC Component Evaluations
1.2 Process Limitation
2.0 APPLICABLE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
Electronic Circuits (IPC)
2.2 Joint Industry Standards
2.3 Electronic Industries Association
3.0 TERMS AND DEFINITIONS
4.0 APPLICATIONS AND OBJECTIVES
4.1 Objectives
4.2 Process Simulations
4.3 Applications
5.0 APPARATUS
6.0 REQUIREMENTS
7.0 RECOMMENDATIONS
8.0 COMPONENT CLASSIFICATION
9.0 COMPONENT STORAGE PROCESS PRECONDITIONING SELECTION
AND PROCESS FLOW
10.0 PRECONDITIONING TEST PROCEDURES
10.1 Moisture Exposure
10.2 Component Placement
10.3 Soldering Process Exposure
10.4 Chemical Exposure
10.5 Acceptance Criteria
11.0 SOLDERING PROCESS COMPATIBILITY MATRIX
Figures
Figure 1 Application of IPC-9504
Figure 2 Assembly Process Simulation
Figure 2 Assembly Process Simulation (continued)
Figure 3 Infrared/Convection Reflow Thermal Profile
Figure 4 Wave Solder Thermal Profile (TH Components)
Figure 5 Wave Solder Thermal Profile (SM Components)
Tables
Table 1 Moisture Sensitivity Floor Life Levels
Table 2 Soldering Process Compatibility Levels Test
Conditions
Table 3 Chemical Compatibility Levels
Table 4 Soldering Process Compatability Matrix