IPC CF 152 : B
Current
The latest, up-to-date edition.
COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
Hardcopy
English
01-12-1997
1 SCOPE
1.1 Purpose
1.2 Designation
1.3 Presentation
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing Materials
2.3 Military Standards
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 General Requirements - Acceptability
3.3 Visual
3.4 Dimensional
3.5 Physical Requirements
3.6 Processing Requirements - Treated Composite Foils
4 QUALITY ASSURANCE PROVISIONS
4.1 Quality Conformance Evaluations
4.2 Classification of Inspections
4.3 Qualification Inspection
4.4 Quality Conformance Inspection
4.5 Test Methods
4.6 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
5.1 Shipping Requirements
5.2 Documentation
5.3 Marking
6 NOTES
6.1 Ordering Data
6.2 References
APPENDIX 1
1 Overlay Volume Ratio
1.A A Chemical Etch Method to Determine Copper Invar
Copper Foil Ratio
1.B Overlay Thickness Ratio for Copper/Invar/Copper
Metal Core
2 Determination of Coefficient of Thermal Expansion
(CTE) Method
2.B Fixturing of Thin Strip/Foil Materials for CTE
Measurements
Figures
Covers the requirements for copper/invar/copper and copper/molybdenum/copper, and three-layer composite materials. Lists visual (pits,dents,wrinkles), dimensional (width, length, thickness), physical (tensile, elongation, bow and twist) and bond integrity requirements. Includes slash sheets and test methods.
DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
Pages |
34
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
IPC TR 482 : 1976 | NEW DEVELOPMENTS IN THIN COPPER FOILS |
IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
I.S. EN 16602-70-11:2015 | SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
BS EN 16602-70-11:2015 | Space product assurance. Procurement of printed circuit boards |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
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