IPC HDBK 850 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
Hardcopy
English
31-07-2012
1 SCOPE
2 APPLICABLE DOCUMENTS
3 P/E MATERIALS
4 ELECTRICAL CONSIDERATIONS
5 REWORK AND REPAIR
6 END USE ENVIRONMENT
7 LONG TERM RELIABILITY AND TESTING
8 EQUIPMENT CONSIDERATIONS
9 DESIGN CONSIDERATIONS IN P/E
10 ENCLOSURE CONSIDERATIONS
11 PREPARATION FOR P/E
12 DISPENSING
13 CURE MECHANISMS
14 APPLICATION PROCESS MONITORING
15 ENVIRONMENTAL, HEALTH AND SAFETY PROCESSING CONSIDERATIONS
16 INHIBITION
17 POTTING/COATING OVER ENCAPSULANTS
18 MATERIALS RELATED TO LEAD FREE PROCESSING THAT
AFFECT P/E
19 REWORK AND REPAIR PROCESSES
20 REGULATIONS
APPENDIX A - MSDS
APPENDIX B - Reference Documents
Helps the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied.
| DevelopmentNote |
Also available in CD-ROM format. (05/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-059-7
|
| Pages |
68
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| SAE AS 12500 : 2018 | CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IEC 61086-2:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IEC 61086-3-1:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3) |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| ASTM D 5470 : 2017 : REDLINE | Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| ASTM D 2520 : 2013 | Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650<sup>o</sup>C |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
| BS EN 61086-1:2004 | Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements |
| ASTM F 1249 : 2013 : REDLINE | Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor |
| IEC 61086-1:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements |
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