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IPC HDBK 850 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY

Available format(s)

Hardcopy

Language(s)

English

Published date

31-07-2012

1 SCOPE
2 APPLICABLE DOCUMENTS
3 P/E MATERIALS
4 ELECTRICAL CONSIDERATIONS
5 REWORK AND REPAIR
6 END USE ENVIRONMENT
7 LONG TERM RELIABILITY AND TESTING
8 EQUIPMENT CONSIDERATIONS
9 DESIGN CONSIDERATIONS IN P/E
10 ENCLOSURE CONSIDERATIONS
11 PREPARATION FOR P/E
12 DISPENSING
13 CURE MECHANISMS
14 APPLICATION PROCESS MONITORING
15 ENVIRONMENTAL, HEALTH AND SAFETY PROCESSING CONSIDERATIONS
16 INHIBITION
17 POTTING/COATING OVER ENCAPSULANTS
18 MATERIALS RELATED TO LEAD FREE PROCESSING THAT
   AFFECT P/E
19 REWORK AND REPAIR PROCESSES
20 REGULATIONS
APPENDIX A - MSDS
APPENDIX B - Reference Documents

Helps the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied.

DevelopmentNote
Also available in CD-ROM format. (05/2016) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
ISBN
978-1-61193-059-7
Pages
68
PublisherName
Institute of Printed Circuits
Status
Current

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