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  • IPC SM 784 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION

    Available format(s):  Hardcopy

    Superseded date:  28-01-2013

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Intended to be an aid to the provider or user of chip on board technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through hole mount to surface mount and on to the finer pitch of chip on board technology.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103 & IPC C 1000. (08/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC J STD 013 : 0 IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
    IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
    IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
    IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
    IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
    IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
    IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
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