IPC SM 784 : 0
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-11-1990
Publisher
Superseded date
28-01-2013
Superseded by
Excluding VAT
Intended to be an aid to the provider or user of chip on board technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through hole mount to surface mount and on to the finer pitch of chip on board technology.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
Summarise