NF EN 60749-20 : 2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
01-11-2021
12-01-2013
AVANT-PROPOS
INTRODUCTION
1 Domaine d'application et objet
2 Références normatives
3 Description générale
4 Appareillage d'essai et matériaux
5 Procédure
6 Informations à inclure dans la spécification applicable
Annexe A (normative) Méthode de controle par tomographie
acoustique
Annexe B (informative) Précisions et descriptions de la
méthode d'essai sur la résistance des
CMS à boîtier plastique à l'effet
combiné de l'humidité et de la chaleur
de soudage
Annexe ZA (normative) Références normatives à d'autres
publications internationales avec les
publications européennes correspondantes
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
| DevelopmentNote |
Indice de classement: C96-022-20. (12/2003) Supersedes NF EN 60749. (06/2007) PR NF EN 60749-20 September 2007. (09/2007)
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Superseded
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| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-20:2010-04 | Identical |
| IEC 60749-20:2008 | Identical |
| NBN EN 60749-20 : 2010 | Identical |
| I.S. EN 60749-20:2009 | Identical |
| UNE-EN 60749-20:2004 | Identical |
| BS EN 60749-20:2009 | Identical |
| EN 60749-20:2009 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| NF EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| NF EN 60749-3 : 2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
| NFC 20 720 : 87 AMD 1 1988 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
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