SEMI E119 : JUL 2006(R2012)
Current
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The latest, up-to-date edition.
MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS
Published date
12-01-2013
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Describes a reduced-pitch front-opening box for interfactory transport of 300 mm wafers (FOBIT).
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (12/2002) Also available in CD-ROM. (07/2006)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI 3D16 : 2016 | SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI 3D2 : 2016 | SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS |
| SEMI E1-9 : NOV 2006E | MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS |
| SEMI E62 : NOV 2006(R2012) | SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS) |
| SEMI E15-1 : 2005(R2010) | SPECIFICATION FOR 300 MM TOOL LOAD PORT |
| SEMI E57 : 2000E2(R2010) | SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 MM WAFER CARRIERS |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI E15 : 1998E2(R2016) | SPECIFICATION FOR TOOL LOAD PORT |
| SEMI E47.1 : NOV 2006 | MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS |
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