SEMI T3 : 2013
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR WAFER BOX LABELS
Published date
12-01-2013
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Specifies a common format, content, size, and location for printed, machine-readable labels on wafer boxes to facilitate communication of data essential for advanced traceability and electronic data exchange systems.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI M8 : 2012 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS |
| SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
| SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
| SEMI M76 : 2010 | SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI M24 : 2007 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS |
| SEMI M1 : 2017 | SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI M74 : 2008(R2018) | SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS |
| SEMI M84 : 2014E | SPECIFICATIONS FOR POLISHED SINGLE CRYSTAL SILICON WAFERS FOR GALLIUM NITRIDE-ON-SILICON APPLICATIONS |
| SEMI M62 : 2017 | SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS |
| SEMI T20.1 : 2009(R2016) | SPECIFICATION FOR OBJECT LABELING TO AUTHENTICATE SEMICONDUCTORS AND RELATED PRODUCTS IN AN OPEN MARKET |
| SEMI M57 : 2016 | SPECIFICATION FOR SILICON ANNEALED WAFERS |
| SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
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