16/30353588 DC : 0
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BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 165000-1:1996
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Film and hybrid integrated circuits Generic specification. Capability approval procedure |
14/30309696 DC : 0
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BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
EN 50461:2006
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Solar cells - Datasheet information and product data for crystalline silicon solar cells |
EN 62137:2004/corrigendum:2005
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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
IEC 62137:2004
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
BS EN 62137:2004
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
05/30134155 DC : DRAFT MAY 2005
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EN 50461 - SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS |
BS IEC 60748-23-1:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
UNE-EN 61020-1:2011
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Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
IEC 60748-23-1:2002
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Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
I.S. EN 60068-2-54:2006
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ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
IEC 62137-4:2014
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Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
BS 9752:1989
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Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
11/30243259 DC : 0
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BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
PD 6521:1988
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Summaries of test methods for environmental testing of electrotechnical products |
BS EN 60068-2-54:2006
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Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
I.S. EN 165000-1:1998
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FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
CEI EN 60068-2-54 : 2007
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ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
IEC 60300-3-5:2001
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Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
I.S. EN 61020-1:2009
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ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 62137:2005
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
IEC 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
IEC 61747-1:1998+AMD1:2003 CSV
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Liquid crystal and solid-state display devices - Part 1: Generic specification |
12/30271778 DC : 0
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BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 62137-4:2014
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Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
11/30243576 DC : DRAFT FEB 2011
|
BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment Generic specification |
13/30264596 DC : 0
|
BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
13/30264600 DC : 0
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BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
BS 2011-4.2:1984
|
Environmental testing. Miscellaneous Guidance on the application of the tests of BS 2011 to simulate the effects of storage |
BS EN 50461:2006
|
Solar cells. Datasheet information and product data for crystalline silicon solar cells |
NF EN 50461 : 2006
|
SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS |
IEC 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 165000-1:1996
|
Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
EN 62137-4:2014/AC:2015
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
EN 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |